Dynamically combined Digital Twins and Digital Shadows for adhesive bonding processes in the automotive industry
A Modern road vehicle production is inconceivable without adhesive bonding technology. Quality assurance in adhesive bonding technology can only be achieved indirectly through holistic control of the process. To achieve this, all steps of the bonding process, from preparation and application to curing, must be digitally mapped, linked, interpreted by innovative IT and transported vertically. The digitalization of adhesive bonding technology is still in its infancy and holistic solutions are not yet available. The aim of DigiKleb is the holistic networking and digitalization of all relevant factors of bonding processes in vehicle construction. The sub-project Dynamic combined digital twins/shadows for bonding processes in the automotive industry supports this with the help of combined dynamic digital twins of the bonding systems. Discrete and continuous simulation (pseudo-process simulation, e.g. of intelligent dosing systems) are combined in order to visualize more detailed information for the bonding-relevant features in the overall system. This can be, for example, information on lines, flow, pumps, etc. With the help of the coupling to the machine and the comparison between simulation and reality, the information obtained can be used for analysis and optimization (e.g. in the context of predective maintenance). Standards (e.g. OPC UA and FMI) are to be used and expanded for: the information modeling for the digital twin/shadow, the coupling to the machines and devices in the plant, as well as the linking of the simulations with each other.EKS InTec GmbH is aiming to expand the existing RF::SUITE components for the virtual plant to include the combination of discrete and continuous simulation models in the digital plant twin.
The DigiKleb research project is funded by the European Union and supported by the Federal Ministry of Economics and Climate Protection (BMWK).